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Hot LO Phonon-Induced RF Nonlinearity in GaN High-Electron-Mobility Transistors

Ankan Ghosh Dastider, Matt Grupen, Nicholas C. Miller, Shaloo Rakheja

Abstract

Hot longitudinal optical (LO) phonons in GaN have recently been identified as a major factor degrading the DC performance of GaN high-electron-mobility transistors (HEMTs) by 30-60%, despite their ultrafast decay. However, their impact on large-signal RF performance, particularly RF linearity, remains poorly understood. Using full-band transport simulations of a fabricated GaN HEMT, we show that even ultrafast LO phonons with a lifetime of 30 fs degrade the output 1-dB compression point and the third-order output intercept power by ~3 dB compared to the case without LO phonon heating. Furthermore, our analysis reveals that improvements in transconductance ($g_\textrm{m}$) flatness do not necessarily translate into improved RF linearity because multiple nonlinear mechanisms contribute to the transistor response, and their combined effect cannot be captured by $g_\mathrm{m}$ flatness alone. This work clarifies a persistent ambiguity in the literature regarding using $g_\mathrm{m}$ flatness as a proxy for RF linearity and establishes fundamental phonon-induced limits on the RF performance of GaN HEMTs.

Hot LO Phonon-Induced RF Nonlinearity in GaN High-Electron-Mobility Transistors

Abstract

Hot longitudinal optical (LO) phonons in GaN have recently been identified as a major factor degrading the DC performance of GaN high-electron-mobility transistors (HEMTs) by 30-60%, despite their ultrafast decay. However, their impact on large-signal RF performance, particularly RF linearity, remains poorly understood. Using full-band transport simulations of a fabricated GaN HEMT, we show that even ultrafast LO phonons with a lifetime of 30 fs degrade the output 1-dB compression point and the third-order output intercept power by ~3 dB compared to the case without LO phonon heating. Furthermore, our analysis reveals that improvements in transconductance () flatness do not necessarily translate into improved RF linearity because multiple nonlinear mechanisms contribute to the transistor response, and their combined effect cannot be captured by flatness alone. This work clarifies a persistent ambiguity in the literature regarding using flatness as a proxy for RF linearity and establishes fundamental phonon-induced limits on the RF performance of GaN HEMTs.

Paper Structure

This paper contains 11 sections, 4 equations, 11 figures, 2 tables.

Figures (11)

  • Figure 1: Schematic cross section of the AlGaN/GaN HEMT (top) and the meshed structure (bottom). Gate Schottky barrier height: 1.2 eV; polarization sheet charge: $1.115\times 10^{13}$ cm$^{-2}$; surface trap density in the source (drain) access region: $1.8\times 10^{12}$ cm$^{-2}$ ($5.2\times 10^{12}$ cm$^{-2}$); acoustic phonon deformation potential: 8.3 eV; LO phonon energy: 92 meV; LO phonon deformation potential: $10^9$ eV/cm.
  • Figure 2: Drain current $I_{\rm D}$ versus drain voltage $V_{\rm DS}$ with different gate biases $V_{\rm GS}$ for the GaN HEMT structure in Fig. \ref{['fig:device_sch']}. Measurements reported by Marino et al.marinoDislocationsGaNHEMT2010
  • Figure 3: Small signal current gain versus frequency for the GaN HEMT in Fig. \ref{['fig:device_sch']}. Measured data reported by Palacios et al.palaciosEmodeGaN2006
  • Figure 4: (a) The simulated steady-state current at $V_\mathrm{GS} = 1$ V and $V_\mathrm{GS} = -1$ V highlights the impact of LO phonon heating on DC response under high bias conditions. The symbol marks the quiescent (Q)-point: $I_\mathrm{D} = 900$ mA/mm, $V_\mathrm{DS} = 6$ V. (b) Output curves at the Q-point for various cases of phonon heating. For each case, the gate bias is adjusted to arrive at the Q point as indicated in the inset table.
  • Figure 5: Two-dimensional heat maps of the peak (a) electron, (b) LO phonon, and (c) acoustic phonon temperatures in the GaN channel. The symbol indicates the Q-point.
  • ...and 6 more figures