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Full-Scale GPU-Accelerated Transient EM-Thermal-Mechanical Co-Simulation for Early-Stage Design of Advanced Packages

Hongyang Liu, Tejas Kulkarni, Ganesh Subbarayan, Cheng-Kok Koh, Dan Jiao

TL;DR

The proposed solver enables full-scale, non-homogenized, time-domain simulation of large-scale packages with runtimes amenable for rapid design iteration, and allows for the identification of signal-induced adiabatic stress that is typically invisible to steady-state and homogenized baselines.

Abstract

In the early-stage design of advanced electronic packages, designers face a critical trade-off between simulation fidelity and computational turnaround time. Conventional early-stage methodologies typically achieve speed by relying on steady-state assumptions and structural homogenization. While computationally efficient, these approximations fundamentally fail to capture dynamic thermal events and stress concentrations at fine-grained internal interfaces, effectively masking failure mechanisms driven by transient signal bursts. In this work, we present a GPU-accelerated transient coupled Electromagnetic-Thermal-Mechanical solver that resolves this bottleneck. The proposed solver enables full-scale, non-homogenized, time-domain simulation of large-scale packages with runtimes amenable for rapid design iteration. Simulation of a NEC SX-Aurora TSUBASA package demonstrates that the tool allows for the identification of signal-induced adiabatic stress that is typically invisible to steady-state and homogenized baselines. This capability brings sign-off level physics fidelity to the early design phase, facilitating the prevention of costly late-stage design failures and broader transient thermal performance degradation risks.

Full-Scale GPU-Accelerated Transient EM-Thermal-Mechanical Co-Simulation for Early-Stage Design of Advanced Packages

TL;DR

The proposed solver enables full-scale, non-homogenized, time-domain simulation of large-scale packages with runtimes amenable for rapid design iteration, and allows for the identification of signal-induced adiabatic stress that is typically invisible to steady-state and homogenized baselines.

Abstract

In the early-stage design of advanced electronic packages, designers face a critical trade-off between simulation fidelity and computational turnaround time. Conventional early-stage methodologies typically achieve speed by relying on steady-state assumptions and structural homogenization. While computationally efficient, these approximations fundamentally fail to capture dynamic thermal events and stress concentrations at fine-grained internal interfaces, effectively masking failure mechanisms driven by transient signal bursts. In this work, we present a GPU-accelerated transient coupled Electromagnetic-Thermal-Mechanical solver that resolves this bottleneck. The proposed solver enables full-scale, non-homogenized, time-domain simulation of large-scale packages with runtimes amenable for rapid design iteration. Simulation of a NEC SX-Aurora TSUBASA package demonstrates that the tool allows for the identification of signal-induced adiabatic stress that is typically invisible to steady-state and homogenized baselines. This capability brings sign-off level physics fidelity to the early design phase, facilitating the prevention of costly late-stage design failures and broader transient thermal performance degradation risks.
Paper Structure (10 sections, 9 equations, 4 figures)

This paper contains 10 sections, 9 equations, 4 figures.

Table of Contents

  1. Introduction
  2. Full-Scale Transient Multiphysics Analysis
  3. Transient Electromagnetic-Thermal Coupling
  4. Thermo-Mechanical Analysis
  5. Simulation Setup
  6. Structure and Material Configuration
  7. Boundary Conditions and Excitation Scheme
  8. Simulation Results
  9. Implementation and Performance
  10. Transient Fields and Reliability Analysis

Figures (4)

  • Figure 1: GDS layout of the simulated advanced package structure showing the distribution of logic and HBM blocks.
  • Figure 2: Normalized transient Joule power distribution at $z=1.6$ mm (Interposer C4 layer) at (a) $t=79$ ps and (b) $t=166$ ps. 0 dB corresponds to the peak value.
  • Figure 3: Transient temperature distribution in Celsius at $z=1.6$ mm at $t=300$ ps. The distribution highlights localized heating missed by steady-state approximations.
  • Figure 4: Mechanical response at $z=1.6$ mm derived from the transient thermal load: (a) Displacement magnitude, and (b) Von Mises stress distribution.