Controlled epitaxy of room-temperature quantum emitters in gallium nitride
Katie M. Eggleton, Joseph K. Cannon, Sam G. Bishop, John P. Hadden, Chunyu Zhao, Menno J. Kappers, Rachel A. Oliver, Anthony J. Bennett
TL;DR
This work demonstrates controlled depth epitaxy of room-temperature GaN quantum emitters on silicon, enabling QE formation in a buried, well-defined layer via a silane-assisted GaN island growth followed by thick GaN overgrowth. Using MOVPE, the authors achieve QEs with high Debye-Waller factors and strong antibunching at room temperature, including $g^{(2)}(0)$ values as low as $0.26\pm0.05$ and DW factors from $0.31$ to $0.63$. Depth validation is achieved through etching and correlative imaging, showing QEs reside within the intended GaN layer above the surface treatment, and overgrowth preserves the buried emitters. The results establish a scalable GaN-on-Si route for integrating bright quantum light sources into cavities, diodes, and photonic circuits, with potential for optical and spin-based quantum technologies.
Abstract
The ability to generate quantum light at room temperature on a mature semiconductor platform opens up new possibilities for quantum technologies. Heteroepitaxial growth of gallium nitride on silicon substrates offers the opportunity to leverage existing expertise and wafer-scale manufacturing to integrate bright quantum emitters in this material within cavities, diodes, and photonic circuits. Until now, it has only been possible to grow GaN QEs at uncontrolled depths on sapphire substrates, which is disadvantageous for potential device architectures. Here, we report a method to produce GaN QEs by metal-organic vapor phase epitaxy at a controlled depth in the crystal through the application of silane treatment and subsequent growth of 3D islands. We demonstrate this process on highly technologically relevant silicon substrates, producing room-temperature QEs with a high Debye Waller factor and strongly anti-bunched emission.
