The splitting field and generators of the elliptic surface $Y^2=X^3 +t^{360} +1$
Sajad Salami
TL;DR
We determine the splitting field ${\mathcal{K}}$ for Shioda's elliptic surface ${\mathcal{E}}: Y^2 = X^3 + t^{360} + 1$ over ${\mathbb{Q}}(t)$, proving that ${\mathcal{K}}$ is the compositum of two high-degree polynomials and locating explicit $68$ generators for ${\mathcal{E}}({\mathcal{K}}(t))$. The method decomposes the Mordell-Weil lattice into the lattices of ten rational elliptic surfaces ${\mathcal{E}}_{a,b}$ and a $K3$ surface ${\mathcal{E}}'$, using birational maps, minimal polynomials, and height pairings, with verification via symbolic computation in Maple and PARI/GP. The authors confirm a maximal rank of $68$ over ${\mathbb{C}}(t)$ for this isotrivial $j=0$ surface and provide a complete computational construction of the splitting field and the 68 independent sections, organized through a detailed base-change framework. This work highlights the interplay between high-degree field extensions and Mordell-Weil group structure, delivering an exact, verified description of the arithmetic of a landmark elliptic surface.
Abstract
The splitting field of an elliptic surface $\mathcal{E}/\mathbb{Q}(t)$ is the smallest finite extension $\mathcal{K} \subset \mathbb{C}$ such that all $\mathbb{C}(t)$-rational points are defined over $\mathcal{K}(t)$. In this paper, we provide a symbolic algorithmic approach to determine the splitting field and a set of $68$ linearly independent generators for the Mordell--Weil lattice of Shioda's elliptic surface $Y^2=X^3 +t^{360} +1$. This surface is noted for having the largest known rank 68 for an elliptic curve over $\mathbb{C}(t)$. Our methodology utilizes the known decomposition of the Mordell-Weil Lattice of this surface into Lattices of ten rational elliptic surfaces and one $K3$ surface. We explicitly compute the defining polynomials of the splitting field, which reach degrees of 1728 and 5760, and verify the results via height pairing matrices and specialized symbolic software packages.
