Liquid metal printing for superconducting circuits
Alexander Kreiner, Navid Hussain, Ritika Dhundhwal, Haoran Duan, Nicolas Zapata, Gabriel Cadilha Marques, Tino Cubaynes, Torsten Scherer, Wolfgang Wernsdorfer, Michael Hirtz, Ioan Mihai Pop, Jasmin Aghassi-Hagmann, Thomas Reisinger
TL;DR
The paper addresses the challenge of fabricating low-loss superconducting circuits in a scalable, additive manner. It introduces capillary-based liquid-metal printing of the eutectic GaInSn alloy to pattern lumped-element resonators on sapphire substrates. Key findings show single-photon quality factors of $Q_i \approx 6\times10^5$ at resonant frequencies around $f_0 \approx 5.8$ GHz, with potential to approach $Q_i$ near $10^6$ under favorable conditions, indicating competitive coherence with lithographic approaches. The study also reveals reliability challenges: repeated thermal cycling induces destructive phase transitions in the liquid metal (e.g., tin pest), linked to microstructural phase separation observed via EDS and optical cryo-microscopy, highlighting the need for materials engineering to enable robust operation. Overall, the method offers a path to additive, locally addressable superconducting circuitry for scalable quantum hardware, contingent on mitigating phase-transition–related degradation through alloy design or alternative inks.
Abstract
Superconducting circuits are a promising platform for implementing fault-tolerant quantum computers, quantum limited amplifiers, ultra-low power superconducting electronics, and sensors with ultimate sensitivity. Typically, circuit fabrication is realized by standard nanolithography, generally associated with a high level of control over defects and contaminants. Additive approaches have not been used so far since they are expected to be inferior in terms of superconducting properties or quantum coherence. This work shows that liquid-metal based micro-pipette printing is suited for fabricating superconducting lumped-element resonators with high internal quality factors. The applicability of our technique for low-loss superconducting device fabrication and the possibility to locally add metal structures, without affecting any preexisting circuit elements, is a further advantage. Our results open up new avenues in the hardware implementation of scaled-up superconducting quantum computers.
