Integration of imprint-free and low coercivity ferroelectric BaTiO3 thin films on silicon
Jingtian Zhao, Beatriz Noheda, Martin F. Sarott
TL;DR
The paper addresses the integration of BaTiO3 on silicon, a CMOS-relevant challenge due to large thermal and lattice mismatch. It introduces a SSTO buffer as a strain-mediating pseudo-substrate to relax thermal strain and impose moderate compressive strain, stabilizing out-of-plane polarization. Key results include imprint-free, low-coercivity switching with $P_r \approx 20\,\mu C\,cm^{-2}$, leakage-free operation, endurance beyond $10^{10}$ cycles, and a two-regime switching dynamics with activation fields around $E_0 \approx 533.8\,kV/cm$ (low freq) and $E_0 \approx 299.6\,kV/cm$ (high freq). The work enables silicon-compatible, low-power ferroelectric devices such as nonvolatile memories and FTJs by delivering high-quality epitaxy with robust switching.
Abstract
Highly-crystalline ferroelectric oxides integrated on Si hold great promise for energy-efficient memory and logic technologies. Exploiting epitaxial strain engineering in these materials is, however, severely hampered on Si, where the large structural mismatch often results in an inferior interfacial quality and causes a degradation of the ferroelectric switching characteristics. In this work, we present the growth of single-crystalline BaTiO3 thin films on Si, exhibiting imprint-free switching, low coercivity, high remanent polarization, and no fatigue for over $10^{10}$ switching cycles. We accomplish this via the insertion of a SrSn1-xTixO3 layer on SrTiO3-buffered Si. This layer serves as a pseudo substrate that alleviates the thermal strain that the Si substrates imposes on the BaTiO3 layer, while simultaneously providing moderate compressive strain that stabilizes a pure out-of-plane polarization. Thus, our work paves the way toward the fabrication of Si-compatible, low-power-consuming ferroelectric devices for non-volatile memory applications.
