Superconducting spin valve effect in Fe/Si$_3$N$_4$/Pb/Si$_3$N$_4$/Fe heterostructures
A. A. Kamashev, N. N. Garif'yanov, A. A. Validov, A. S. Osin, Ya. V. Fominov, I. A. Garifullin
TL;DR
This work investigates superconducting spin valve behavior in Fe/Si$_3$N$_4$/Pb/Si$_3$N$_4$/Fe heterostructures with ultrathin insulating spacers to tailor S/F interface transparency. By varying the superconducting Pb thickness $d_ ext{Pb}$ and insulating Si$_3$N$_4$ thickness $d_ ext{Si_{3}N_{4}}$, the authors observe a sizable full SSV effect, with $\Delta T_c$ reaching up to $0.36$ K under $H_0 \approx 1$ kOe. The experimental findings are interpreted via a symmetric F1/S/F2 proximity-model treating $d_ ext{Si_{3}N_{4}}$ as an interface resistance parameter $\gamma_b$, yielding qualitative agreement and quantitative parameter fits (e.g., $\xi_S=40$ nm, $\xi_F=5$ nm, $\gamma=0.038$, $h=0.075$ eV). The results demonstrate tunable, robust SSV behavior in conventional materials and controlled insulating barriers, informing future spintronic device designs that leverage the proximity effect.
Abstract
The structures of the superconducting spin valve (SSV) Fe/Si$_3$N$_4$/Pb/Si$_3$N$_4$/Fe (where Si$_3$N$_4$ is a dielectric insulating layer of controlled thickness) were investigated. The dependence of the magnitude of the SSV effect on the thicknesses of the superconducting (S) and insulating (I) layers was studied. Optimization of the S and I layer thicknesses enabled a complete switching between the normal and superconducting states when the mutual orientation of the magnetizations of the ferromagnetic (F) layers changed from antiparallel to parallel. A maximal SSV effect value of 0.36\,K was achieved in an external magnetic field of 1\,kOe. These results demonstrate that SSV structures with tunable S/F interface transparency controlled by insulating interlayers are promising for achieving a significant magnitude of the effect. This opens new avenues for the development of such systems and their potential applications in spintronic devices.
