Acoustic phonon-restricted four-phonon interactions: Impact on thermal and thermoelectric transport in monolayer h-NbN
Himanshu Murari, Subhradip Ghosh, Mukul Kabir, Ashis Kundu
TL;DR
This work addresses heat and charge transport in the 2D buckled h-NbN monolayer, where mirror-symmetry breaking and a large acoustic–optical gap amplify higher-order phonon processes. Using first-principles density functional theory and Boltzmann transport theory, it shows that four-phonon scattering, especially among acoustic modes and ZA phonons, severely limits the lattice thermal conductivity $\kappa_l$. Tensile strain reduces anharmonicity, modestly increasing $\kappa_l$ while also narrowing the electronic gap and enhancing electrical conductivity, leading to a thermoelectric figure of merit of about $zT \approx 0.7$ at high temperatures when four-phonon effects are included. Overall, the results highlight the necessity of incorporating multi-phonon processes and strain effects for accurate predictions of thermal and thermoelectric performance in low-dimensional materials.
Abstract
To explore the thermal and thermoelectric potential of 2D materials, we study the h-NbN monolayer, which lacks mirror symmetry and features a large acoustic-optical phonon gap and quadratic flexural mode. First-principles calculations and the Boltzmann transport formalism reveal a complex interplay of multi-phonon scattering processes, where flexural phonons and four-phonon interactions play a significant role in heat transport, primarily dominated by acoustic phonons. Notably, the four-phonon interactions are predominantly confined to acoustic phonons. Tensile strain preserves the underlying scattering mechanisms while reducing anharmonicity, consequently, the scattering rates, enhancing thermal conduction. Simultaneously, competing modifications in thermal and electrical transport shape the strain-dependent thermoelectric response, achieving a figure of merit approaching 1 at elevated temperatures, a testament to its thermoelectric promise. Our findings underscore the critical role of microscopic transport modeling in accurately capturing thermal and thermoelectric properties, paving the way for advanced applications of 2D materials.
