MODRIC: A Cost Effective MODular Data Center Network Architecture with Rich InterConnections

TL;DR

MODRIC introduces a cost-effective modular data center network that decouples intra-container and inter-container networks and uses rich inter-container interconnections modeled after a generalized-hypercube. It combines a two-layer Clos-like intra-container topology with a generalized grid inter-container network to achieve small diameter, multiple node-disjoint paths, high bisection bandwidth, and scalable expansion, while leveraging commodity or merchant-silicon switches. The architecture is complemented by location-based addressing, OpenFlow-based SDN control, and fault-tolerant routing, with supporting analyses of topology properties, construction, cost, and performance. In Mininet-based evaluations, MODRIC consistently delivers higher throughput and better fault tolerance than Fat-tree, Jellyfish, MDCube, and uFix under diverse traffic patterns and failures, demonstrating practical applicability for mega data centers. The work suggests MODRIC as a viable pathway to high-throughput, resilient data centers using commodity hardware and scalable inter-container connectivity.

Abstract

Shipping container based modular architectures provide design flexibility in data centers with building blocks to expand the network as and when needed. In this paper, high capacity Modular Data Center (MDC) network architecture with Rich Inter Connections named MODRIC is proposed. MODRIC is a cost-effective switch-centric network design which allows building a flexible MDC network with commodity switches. It uses an inter-container connectivity similar to the structure of generalized hypercube in order to provide high inter-container bandwidth. Further, a hybrid Clos topology is used to build the container network. MODRIC is highly suitable for cost effectively building mega data centers requiring high throughput capacity and resilience against failures. This paper presents the proposed architecture, discusses its relevant properties, and proposes suitable addressing, routing and network construction schemes. The paper also presents comparative studies on its cost and performance with existing network topologies.

Figures (17)

• Figure 1: Top down canonical view of a MODRIC container (cid = 11) with four ASes (114, 115, 116, 117). a. Graphical view showing the EPSs and ASes and the interconnections. Inter-EPSC S1 links between a pair of EPSCs are shown as a single thick dark link. ASes are connected to EPSCs through S1 links. b. View of the container where ASes are located on top of racks containing the servers connected to each AS (blue shelves, S2 links are not shown) and each EPSC containing three EPSes connected to each other. All the connections shown are with S1 links.
• Figure 2: A 2x3 MODRIC network (showing the containers with EPSCs and the inter-container connectivity. The numbers with larger digits are container ids and the ones with smaller digits are EPSC ids)
• Figure 3: Network diameter of MODRIC shown with 9 points between a pair of source and destination hosts. Points 3, 5, and 7 contribute one hop distance each due to EPSC connectivity.
• Figure 4: Each container is of length L and width W. Adjacent containers are spaced at dL and dW distance apart along the row and column directions, respectively.
• Figure 5: Illustration of the MODRIC network setup