Reducing Simulation Effort for RIS Optimization using an Efficient Far-Field Approximation
Hans-Dieter Lang, Michel A. Nyffenegger, Heinz Mathis, Xingqi Zhang
TL;DR
The paper tackles the high computational cost of RIS optimization, which relies on multiport impedance or scatter matrices for every Tx/Rx position. It introduces a far-field extrapolation that builds the full $(N+2)\times(N+2)$ S-matrix from a single RIS simulation by modeling Tx–RIS and RIS–Rx couplings as far-field two-port links, using distances $d_{Tx-m}$, angles $\gamma_{Tx-m}$, and gains $G_m(\gamma)$ in the expressions for $S_{Tx-m}$ and $S_{Rx-m}$. The approach yields optimized capacitance values that closely match those from full-wave simulations and is corroborated by BRCS measurements, demonstrating practical validity. By reducing the need for repeated full-wave runs, the method can significantly speed RIS design and optimization in realistic NLOS scenarios.
Abstract
Optimization of Reconfigurable Intelligent Surfaces (RIS) via a previously introduced method is effective, but time-consuming, because multiport impedance or scatter matrices are required for each transmitter and receiver position, which generally must be obtained through full-wave simulation. Herein, a simple and efficient far-field approximation is introduced, to extrapolate scatter matrices for arbitrary receiver and transmitter positions from only a single simulation while still maintaining high accuracy suitable for optimization purposes. This is demonstrated through comparisons of the optimized capacitance values and further supported by empirical measurements.
