TransPlace: Transferable Circuit Global Placement via Graph Neural Network
Yunbo Hou, Haoran Ye, Shuwen Yang, Yingxue Zhang, Siyuan Xu, Guojie Song
TL;DR
TransPlace tackles global placement for circuits with millions of mixed-size cells by learning transferable placement knowledge through a graph-based Netlist Graph and a two-stage inductive-plus-fine-tuning pipeline. It introduces Cell-flow for relative positioning, SE(2)-invariant encoding/decoding to preserve geometry, and the Transferable Placement Graph Neural Network (TPGNN) to perform topology- and geometry-aware message passing, followed by circuit-adaptive fine-tuning to adapt to unseen designs. Across multiple benchmarks, TransPlace achieves a 1.2× speedup, reduces congestion by ~30%, and yields improvements in timing (~9%) and wirelength (~5%), while demonstrating strong cross-design transfer and cross-objective robustness. The approach offers a scalable, learning-based alternative to traditional placers, providing warm starts and potential acceleration for practical chip-design workflows.
Abstract
Global placement, a critical step in designing the physical layout of computer chips, is essential to optimize chip performance. Prior global placement methods optimize each circuit design individually from scratch. Their neglect of transferable knowledge limits solution efficiency and chip performance as circuit complexity drastically increases. This study presents TransPlace, a global placement framework that learns to place millions of mixed-size cells in continuous space. TransPlace introduces i) Netlist Graph to efficiently model netlist topology, ii) Cell-flow and relative position encoding to learn SE(2)-invariant representation, iii) a tailored graph neural network architecture for informed parameterization of placement knowledge, and iv) a two-stage strategy for coarse-to-fine placement. Compared to state-of-the-art placement methods, TransPlace-trained on a few high-quality placements-can place unseen circuits with 1.2x speedup while reducing congestion by 30%, timing by 9%, and wirelength by 5%.
