Hybrid Model-Data Fault Diagnosis for Wafer Handler Robots: Tilt and Broken Belt Cases
Tim van Esch, Farhad Ghanipoor, Carlos Murguia, Nathan van de Wouw
TL;DR
This work tackles fault detection, isolation, and estimation for wafer handler robots by blending model-based fault estimation with a data-driven classifier. Faults are treated as additive signals within a state-space framework, enabling an ultra-local fault representation and an ISS-stable augmented observer whose LMIs yield robust $H_\infty$ and $H_2$ performance. The data-driven stage uses SVMs trained on fault estimates to achieve high fault isolation accuracy, and experiments show the hybrid FDIE outperforms pure data-driven approaches, particularly for smaller faults like tilt. The approach has practical impact by enabling more reliable, scheduled maintenance in semiconductor manufacturing and reducing downtime.
Abstract
This work proposes a hybrid model- and data-based scheme for fault detection, isolation, and estimation (FDIE) for a class of wafer handler (WH) robots. The proposed hybrid scheme consists of: 1) a linear filter that simultaneously estimates system states and fault-induced signals from sensing and actuation data; and 2) a data-driven classifier, in the form of a support vector machine (SVM), that detects and isolates the fault type using estimates generated by the filter. We demonstrate the effectiveness of the scheme for two critical fault types for WH robots used in the semiconductor industry: broken-belt in the lower arm of the WH robot (an abrupt fault) and tilt in the robot arms (an incipient fault). We derive explicit models of the robot motion dynamics induced by these faults and test the diagnostics scheme in a realistic simulation-based case study. These case study results demonstrate that the proposed hybrid FDIE scheme achieves superior performance compared to purely data-driven methods.
