Fractures and thin heterogeneities as Robin-Wentzell interface conditions
Marco Favino
TL;DR
This work develops a reduced modeling approach for fractures and thin heterogeneities in diffusion and Darcy flow by replacing thin inclusions with interface conditions. The key contributions are the derivation of Wentzell-type conditions for the flux jump and Robin-type conditions for the flux average, a general weak formulation suitable for finite element discretization, and extensive numerical validation across conductive and blocking fractures, including networks and varying apertures. The method enables accurate macroscopic behavior without explicit fracture meshes, and naturally extends to fracture intersections and complex networks. It also offers a flexible framework applicable to general diffusion problems with thin heterogeneities and to potential multi-physics extensions, with future work addressing regularity and advanced discretizations such as CutFEM/XFEM.
Abstract
We formally derive interface conditions for modeling fractures in Darcy flow problems and, more generally, thin inclusions in heterogeneous diffusion problems expressed as the divergence of a flux. Through a formal integration of the governing equations within the inclusions, we establish that the resulting interface conditions are of Wentzell type for the flux jump and Robin type for the flux average. Notably, the flux jump condition is unconventional, involving a tangential diffusion operator applied to the average of the solution across the interface. The corresponding weak formulation is introduced, offering a framework that is readily applicable to finite element discretizations. Extensive numerical validation highlights the robustness and versatility of the proposed modeling technique. The results demonstrate its effectiveness in accommodating a wide range of material properties, managing networks of inclusions, and naturally handling fractures with varying apertures -- all without requiring an explicit geometric representation of the fractures.
