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SolderlessPCB: Reusing Electronic Components in PCB Prototyping through Detachable 3D Printed Housings

Zeyu Yan, Jiasheng Li, Zining Zhang, Huaishu Peng

TL;DR

SolderlessPCB tackles the wasteful practice of discarding SMD components after PCB prototyping by enabling solder-free mounting of components through detachable 3D-printed housings. The approach combines bolt-based anchoring, cavity designs for two-terminal components and ICs, and a practical design workflow in Fusion 360 to allow easy disassembly and reuse of functional parts. Electrical and durability tests show low contact resistance, minimal high-frequency loss, and reliable performance across iterations, while demonstrations across kitchen timers, bristlebots, mug heaters, game consoles, and FTDI units illustrate broad applicability. The work highlights sustainable prototyping workflows, compatibility with outsourced PCBs, and avenues for automation and integration into existing design processes to reduce electronic waste.

Abstract

The iterative prototyping process for printed circuit boards (PCBs) frequently employs surface-mounted device (SMD) components, which are often discarded rather than reused due to the challenges associated with desoldering, leading to unnecessary electronic waste. This paper introduces SolderlessPCB, a collection of techniques for solder-free PCB prototyping, specifically designed to promote the recycling and reuse of electronic components. Central to this approach are custom 3D-printable housings that allow SMD components to be mounted onto PCBs without soldering. We detail the design of SolderlessPCB and the experiments conducted to evaluate its design parameters, electrical performance, and durability. To illustrate the potential for reusing SMD components with SolderlessPCB, we discuss two scenarios: the reuse of components from earlier design iterations and from obsolete prototypes. We also provide examples demonstrating that SolderlessPCB can handle high-current applications and is suitable for high-speed data transmission. The paper concludes by discussing the limitations of our approach and suggesting future directions to overcome these challenges.

SolderlessPCB: Reusing Electronic Components in PCB Prototyping through Detachable 3D Printed Housings

TL;DR

SolderlessPCB tackles the wasteful practice of discarding SMD components after PCB prototyping by enabling solder-free mounting of components through detachable 3D-printed housings. The approach combines bolt-based anchoring, cavity designs for two-terminal components and ICs, and a practical design workflow in Fusion 360 to allow easy disassembly and reuse of functional parts. Electrical and durability tests show low contact resistance, minimal high-frequency loss, and reliable performance across iterations, while demonstrations across kitchen timers, bristlebots, mug heaters, game consoles, and FTDI units illustrate broad applicability. The work highlights sustainable prototyping workflows, compatibility with outsourced PCBs, and avenues for automation and integration into existing design processes to reduce electronic waste.

Abstract

The iterative prototyping process for printed circuit boards (PCBs) frequently employs surface-mounted device (SMD) components, which are often discarded rather than reused due to the challenges associated with desoldering, leading to unnecessary electronic waste. This paper introduces SolderlessPCB, a collection of techniques for solder-free PCB prototyping, specifically designed to promote the recycling and reuse of electronic components. Central to this approach are custom 3D-printable housings that allow SMD components to be mounted onto PCBs without soldering. We detail the design of SolderlessPCB and the experiments conducted to evaluate its design parameters, electrical performance, and durability. To illustrate the potential for reusing SMD components with SolderlessPCB, we discuss two scenarios: the reuse of components from earlier design iterations and from obsolete prototypes. We also provide examples demonstrating that SolderlessPCB can handle high-current applications and is suitable for high-speed data transmission. The paper concludes by discussing the limitations of our approach and suggesting future directions to overcome these challenges.
Paper Structure (54 sections, 1 equation, 25 figures)

This paper contains 54 sections, 1 equation, 25 figures.

Table of Contents

  1. Introduction
  2. Related Work
  3. Sustainability in HCI: Making and Prototyping
  4. Supporting the Reuse of Electronics
  5. Circuit Assembly and Disassembly
  6. Understanding the Current PCB Prototyping Practice
  7. Method
  8. Findings
  9. Circuit validation with breadboarding
  10. PCB prototyping and assembly
  11. Design Implications
  12. SolderlessPCB
  13. Housing Anchoring and Pressure Generation
  14. Snap-fit
  15. Screw bolting
  16. ...and 39 more sections

Figures (25)

  • Figure 1: SolderlessPCB: a) rendering of an exploded view of a SolderlessPCB assembly. b) a photo of a SolderlessPCB assembly.
  • Figure 2: Snap-fit housing PCB assembly with zoomed-in view.
  • Figure 3: SolderlessPCB assembly using bolts.
  • Figure 4: Flexible tab structure accommodating two-terminal components: a) a 0805 component with a housing cavity featuring flexible tabs, b) an exploded view illustration of the housing, a two-terminal component, and the PCB, c) an illustration of the housing pressing the component onto the PCB using flexible tabs.
  • Figure 5: Type 1 IC: a) IC with extended metal pins; b) illustration of unsettled extended pins when pressure is applied at the center; c) illustration of all pins complying when the housing structure is pressed directly upon them.
  • ...and 20 more figures