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3D-Printed Dielectric Image Lines towards Chip-to-Chip Interconnects for subTHz-Applications

Leonhard Hahn, Tim Pfahler, Tobias Bader, Gerald Gold, Martin Vossiek, Christian Carlowitz

TL;DR

This work addresses the challenge of distributing subTHz signals with low loss for multi-channel chip-to-chip interconnects. It proposes 3D-printed dielectric image lines (DIL) placed on a copper substrate and paired with a CNC-milled mode-converter to excite the $HE_{11}$-like mode, enabling measurements from $140$ GHz to $220$ GHz. The study characterizes the DILs through S-parameter measurements, de-embedding of the propagation constants, and a detailed assessment of discontinuities, reporting average attenuation around $0.25$ dB/cm and maximum $0.35$ dB/cm with a broadband return loss near $20$ dB. These results, together with the low-cost manufacturing and mechanical stability afforded by the copper anchor, indicate that 3D-printed DILs are a viable, flexible solution for subTHz interconnect networks and multi-channel signal routing, provided bends are kept to moderate radii (e.g., $r\gtrsim30$ mm).

Abstract

This paper reports on 3D-printed dielectric image lines for low-loss subTHz applications between 140 and 220 GHz. In contrast to conventional dielectric waveguides, a conductive copper substrate is used to achieve robust routing and increased mechanical stability. For easy integration and characterization of the dielectric image line within a waveguide measurement setup, a low-loss mode-converter for flexible mounting is further designed. The characterized overall system exhibits a broadband match of at least 20 dB over the entire frequency band, with minimal losses of below 0.35 dB/cm. Furthermore, multi-line characterization is performed for de-embedding the propagation parameters α and \b{eta} of both the dielectric transmission line and the mode-converter, and finally, the influence of discontinuities such as bending radii on the transmission behavior is evaluated. Due to the simplicity of the underlying 3D-printing technology, the proposed concept features extremely low cost and complexity, yet offers high flexibility and outperforms the losses of conventional transmission lines.

3D-Printed Dielectric Image Lines towards Chip-to-Chip Interconnects for subTHz-Applications

TL;DR

This work addresses the challenge of distributing subTHz signals with low loss for multi-channel chip-to-chip interconnects. It proposes 3D-printed dielectric image lines (DIL) placed on a copper substrate and paired with a CNC-milled mode-converter to excite the -like mode, enabling measurements from GHz to GHz. The study characterizes the DILs through S-parameter measurements, de-embedding of the propagation constants, and a detailed assessment of discontinuities, reporting average attenuation around dB/cm and maximum dB/cm with a broadband return loss near dB. These results, together with the low-cost manufacturing and mechanical stability afforded by the copper anchor, indicate that 3D-printed DILs are a viable, flexible solution for subTHz interconnect networks and multi-channel signal routing, provided bends are kept to moderate radii (e.g., mm).

Abstract

This paper reports on 3D-printed dielectric image lines for low-loss subTHz applications between 140 and 220 GHz. In contrast to conventional dielectric waveguides, a conductive copper substrate is used to achieve robust routing and increased mechanical stability. For easy integration and characterization of the dielectric image line within a waveguide measurement setup, a low-loss mode-converter for flexible mounting is further designed. The characterized overall system exhibits a broadband match of at least 20 dB over the entire frequency band, with minimal losses of below 0.35 dB/cm. Furthermore, multi-line characterization is performed for de-embedding the propagation parameters α and \b{eta} of both the dielectric transmission line and the mode-converter, and finally, the influence of discontinuities such as bending radii on the transmission behavior is evaluated. Due to the simplicity of the underlying 3D-printing technology, the proposed concept features extremely low cost and complexity, yet offers high flexibility and outperforms the losses of conventional transmission lines.
Paper Structure (6 sections, 10 figures)

This paper contains 6 sections, 10 figures.

Table of Contents

  1. Introduction
  2. Image Line Topology
  3. Measurement Setup
  4. Results
  5. Conclusion
  6. Acknowledgement

Figures (10)

  • Figure 1: 3D-printed dielectric image lines on top of a copper substrate.
  • Figure 2: Electric and magnetic field distribution of a conventional dielectric waveguide (top) and its corresponding image line (bottom).
  • Figure 3: Measurement setup for the back-to-back characterization of DIL system (top) with sectional view of its schematic (bottom).
  • Figure 4: CNC-milled mode-converter in split-block technology with WR05 waveguide flange for $HE_{11}$ mode excitation of the 3D-printed DIL.
  • Figure 5: Influence of the DIL's initial tapering length on their simulated return loss.
  • ...and 5 more figures